Title:
CURABLE RESIN COMPOSITION, DRY FILM, RESIN-CLAD COPPER FOIL, CURED PRODUCT, AND ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2020/116512
Kind Code:
A1
Abstract:
[Problem] To provide: a curable resin composition from which a cured product having high heat resistance, a low dielectric loss tangent and high adhesion to a conductor can be produced; and a dry film, a resin-clad copper foil, a cured product and an electronic component that contain the curable resin composition. [Solution] Provided are: a resin composition which contains an epoxy resin (A) and a compound (B) having an active ester group, and which is characterized in that the ratio of the total amount of epoxy groups in the epoxy resin (A)/the total amount of active ester groups in the compound (B) having an active ester group in the composition is 0.2-0.6; and a dry film, a resin-clad copper foil, a cured product and an electronic component that contain the curable resin composition.
Inventors:
YAMOTO KAZUHISA (JP)
AOYAMA YOSHITOMO (JP)
MIYABE HIDEKAZU (JP)
AOYAMA YOSHITOMO (JP)
MIYABE HIDEKAZU (JP)
Application Number:
PCT/JP2019/047428
Publication Date:
June 11, 2020
Filing Date:
December 04, 2019
Export Citation:
Assignee:
TAIYO INK MFG CO LTD (JP)
International Classes:
C08G59/42; C08K3/013; C08L63/00; H05K1/03; H05K3/28
Foreign References:
| JP2011174035A | 2011-09-08 | |||
| JP2016132777A | 2016-07-25 | |||
| JP2018172519A | 2018-11-08 | |||
| JP2016069519A | 2016-05-09 | |||
| JP2014208764A | 2014-11-06 | |||
| JP2019183070A | 2019-10-24 |
Attorney, Agent or Firm:
ETOH Toshiaki (JP)
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