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Patent Searching and Data


Title:
CURABLE RESIN COMPOSITION, DRY FILM, CURED PRODUCT, AND ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2020/202690
Kind Code:
A1
Abstract:
Provided is a curable resin composition which improves the compatibility of a curable resin having a repeating unit derived from a maleimide-based monomer and a repeating unit derived from an unsaturated carboxylic acid monomer, and from which a cured product having excellent reliability is obtained. This curable resin composition is characterized by comprising: (A) a curable copolymer resin having a first repeating unit represented by formula (1) and a second repeating unit represented by formula (2); (B) a thermosetting resin; and (C) an acrylic copolymer compound different from the component (A), wherein the compounding amount of the component (C) is 0.01-5 parts by mass with respect to 100 parts by mass in total of the compounding amounts of the component (A) and the component (B). (In formula (1), R0 represents a monovalent organic group having 1-30 carbon atoms, and in formula (2), R1 represents a hydrogen atom or an organic group having 1-7 carbon atoms.)

Inventors:
UETA CHIHO (JP)
OKADA KAZUYA (JP)
KUDO TOMOYA (JP)
SHIMADA SAWAKO (JP)
TANE SHOTARO (JP)
Application Number:
PCT/JP2020/000761
Publication Date:
October 08, 2020
Filing Date:
January 10, 2020
Export Citation:
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Assignee:
TAIYO INK MFG CO LTD (JP)
International Classes:
C08L33/08; C08L35/00; C08L63/00; C08L101/00
Domestic Patent References:
WO2016132962A12016-08-25
WO2016092597A12016-06-16
Foreign References:
JP2017102432A2017-06-08
JP2016216606A2016-12-22
JP2018172632A2018-11-08
JP2013227430A2013-11-07
JP2010160419A2010-07-22
Attorney, Agent or Firm:
HONDA Ichiro (JP)
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