Title:
CURABLE RESIN COMPOSITION AND DRY FILM
Document Type and Number:
WIPO Patent Application WO/2022/107747
Kind Code:
A1
Abstract:
[Problem] To provide a curable resin composition which has excellent cleaning removability even when adhered to a mixing tub or tool used in a production process of solder resist ink, and dried. [Solution] A curable resin composition according to the present invention comprises (A) a curable resin, (B) a filler, and (C) an organic solvent, and is characterized in that the dissolution start time of a completely dried coating film, which has a size of 20 mm (length) × 20 mm (width) × 7 μm (film thickness) and is formed using the curable resin composition, in propylene glycol monomethyl ether acetate serving as a cleaning solvent is within 20 seconds from the start of immersion in the cleaning solvent.
Inventors:
TOKUMITSU KAYOKO (JP)
MATSUO AKIHIKO (JP)
KURITA MASATOSHI (JP)
KANEKO TSUYOSHI (JP)
TAKII YOJI (JP)
MATSUO AKIHIKO (JP)
KURITA MASATOSHI (JP)
KANEKO TSUYOSHI (JP)
TAKII YOJI (JP)
Application Number:
PCT/JP2021/042029
Publication Date:
May 27, 2022
Filing Date:
November 16, 2021
Export Citation:
Assignee:
TAIYO INK MFG CO LTD (JP)
International Classes:
C08L101/00; C08G8/28; C08G59/17; C08K3/013; C08L101/08; G03F7/004; G03F7/027; G03F7/038; H05K1/03; H05K3/28
Domestic Patent References:
| WO2018123695A1 | 2018-07-05 |
Foreign References:
| JP2020166207A | 2020-10-08 | |||
| JP2020200449A | 2020-12-17 |
Attorney, Agent or Firm:
NAKAMURA Yukitaka et al. (JP)
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