Title:
CURABLE RESIN COMPOSITION AND ELECTRONIC COMPONENT DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/240079
Kind Code:
A1
Abstract:
This curable resin composition contains a curable resin and a compound represented by general formula (1). In general formula (1), R1 through R3 each independently represents a monovalent hydrocarbon group.
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Inventors:
NAKAMURA SHINYA (JP)
ISHIGURO TADASHI (JP)
OHSHITA TSUYOSHI (JP)
ENDO YOSHINORI (JP)
ISHIGURO TADASHI (JP)
OHSHITA TSUYOSHI (JP)
ENDO YOSHINORI (JP)
Application Number:
PCT/JP2019/022928
Publication Date:
December 19, 2019
Filing Date:
June 10, 2019
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
C08L101/00; C08G59/62; C08G59/68; C08K3/013; C08K5/3492; C08L63/00; H01L23/29; H01L23/31
Domestic Patent References:
| WO2012067092A1 | 2012-05-24 | |||
| WO2017112766A1 | 2017-06-29 | |||
| WO2007013284A1 | 2007-02-01 |
Foreign References:
| JP2014136779A | 2014-07-28 | |||
| JP2016074849A | 2016-05-12 | |||
| JP2017137434A | 2017-08-10 | |||
| JPH09157497A | 1997-06-17 | |||
| JP2002114890A | 2002-04-16 |
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO (JP)
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