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Title:
CURABLE RESIN COMPOSITION AND ELECTRONIC COMPONENT DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/075453
Kind Code:
A1
Abstract:
A curable resin composition comprising a curable resin and a compound represented by general formula (A). In general formula (A), R11 to R16 each independently represent a hydrogen atom, -CH2OH, or -CH2OR17, R17 representing an alkyl group having 1-3 carbon atoms, and at least one of R11 to R16 represents -CH2OR17.

Inventors:
INOUE YUKIKO (JP)
OHSHITA TSUYOSHI (JP)
KANG DONGCHUL (JP)
Application Number:
PCT/JP2021/037352
Publication Date:
April 14, 2022
Filing Date:
October 08, 2021
Export Citation:
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Assignee:
SHOWA DENKO MATERIALS CO LTD (JP)
International Classes:
H01L23/29; C08K3/013; C08K5/3492; C08K5/50; C08L61/00; C08L63/00; C08L101/00; H01L23/31
Domestic Patent References:
WO2019240079A12019-12-19
Foreign References:
JPH03107846A1991-05-08
JP2006249143A2006-09-21
JP2011012205A2011-01-20
JP2011157502A2011-08-18
JPH03296558A1991-12-27
KR20150129927A2015-11-23
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO (JP)
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