Title:
CURABLE RESIN COMPOSITION AND ELECTRONIC COMPONENT DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/186361
Kind Code:
A1
Abstract:
Provided is a curable resin composition containing: an epoxy resin; a curing agent; and a linear polysiloxane compound that has a structural unit having an epoxy group and an alkoxy group, and that also has a polymerization degree of 3 or more.
Inventors:
NISHIYAMA TOMOO (JP)
KANG DONGCHUL (JP)
YAMAMOTO TAKAYA (JP)
KIM KIFA (JP)
KANG DONGCHUL (JP)
YAMAMOTO TAKAYA (JP)
KIM KIFA (JP)
Application Number:
PCT/JP2022/009257
Publication Date:
September 09, 2022
Filing Date:
March 03, 2022
Export Citation:
Assignee:
SHOWA DENKO MATERIALS CO LTD (JP)
International Classes:
C08G59/20; C08L63/00; C08L83/04; C08L83/06; H01L23/29; H01L23/31
Domestic Patent References:
| WO2020080370A1 | 2020-04-23 | |||
| WO2008077915A1 | 2008-07-03 |
Foreign References:
| US20170247607A1 | 2017-08-31 | |||
| JP2008111101A | 2008-05-15 | |||
| JP2020045425A | 2020-03-26 |
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO (JP)
Download PDF: