Title:
CURABLE RESIN COMPOSITION FOR ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/112982
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a curable resin composition for electronic devices that, in the form of an article cured therefrom, has exceptional heat resistance and minimal outgassing while having a low dielectric constant. The present invention is a curable resin composition for electronic devices, said composition containing a curable resin and a polymerization initiator, wherein said curable resin contains a compound represented by formula (1) and a polyfunctional cationically polymerizable compound, the polymerization initiator contains a cationic polymerization initiator, and the glass transition temperature of an cured article made from the curable resin composition for electronic devices is 90°C or higher. In formula (1), R1-R6 each independently are a hydrogen atom, an alkyl group, or an alkoxy group, and X is a hydrogen atom or a group represented by formula (2-1), (2-2), (2-3), (2-4), or (2-5). R7 in formula (2-2) and R8 in formula (2-3) are linear or branched C1-10 alkyl groups in which some or all of the hydrogen atoms are optionally substituted by halogen atoms. Ph in formula (2-4) and Ph in formula (2-5) are phenyl groups in which some or all of the hydrogen atoms are optionally substituted by halogen atoms. The asterisk symbol in formulas (2-1)-(2-5) represents a bonding position.
Inventors:
TAKENAKA MIKA (JP)
YAMAMOTO TAKUYA (JP)
YAMAMOTO TAKUYA (JP)
Application Number:
PCT/JP2022/046185
Publication Date:
June 22, 2023
Filing Date:
December 15, 2022
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
C08G59/24; C08G59/30
Domestic Patent References:
| WO2017159637A1 | 2017-09-21 |
Foreign References:
| JP2021073352A | 2021-05-13 | |||
| JP2021050290A | 2021-04-01 |
Attorney, Agent or Firm:
WISEPLUS IP FIRM (JP)
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