Title:
CURABLE RESIN COMPOSITION, FILM USING SAME, AND MOLDED ARTICLE USING FILM
Document Type and Number:
WIPO Patent Application WO/2019/235086
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a curable resin composition that is capable of forming a cured coating film which has high chemical resistance, while having an elongation that does not interfere with injection molding. A curable resin composition according to the present invention contains (A) a polyurethane (meth)acrylate compound which has a urethane bond equivalent weight of 210 g/mol or less, (B) a polymerization initiator and (C) an aprotic polar solvent.
Inventors:
ONO SHINJI (JP)
Application Number:
PCT/JP2019/016972
Publication Date:
December 12, 2019
Filing Date:
April 22, 2019
Export Citation:
Assignee:
NEOS COMPANY LTD (JP)
International Classes:
C08F299/06; C08F290/06; C08J7/043; C08J7/046
Foreign References:
| JP2015224257A | 2015-12-14 | |||
| JP2017101221A | 2017-06-08 | |||
| JP2016020489A | 2016-02-04 | |||
| JP2011042770A | 2011-03-03 | |||
| JP2016008266A | 2016-01-18 | |||
| JPH11279486A | 1999-10-12 | |||
| JPH05163318A | 1993-06-29 |
Attorney, Agent or Firm:
GLOBAL IP TOKYO (JP)
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