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Patent Searching and Data


Title:
CURABLE RESIN COMPOSITION, HARD COAT FILM, AND PRODUCTION METHOD FOR HARD COAT FILM
Document Type and Number:
WIPO Patent Application WO/2022/259893
Kind Code:
A1
Abstract:
Provided are: a curable resin composition comprising a polymer (S) having at least one structural unit that is selected from the group consisting of structural units (a) which include a fluorine atom and structural units (b) which include a cationically polymerizable group and a structural unit (z) that is represented by general formula (Z-1) which is set forth in the specification; a hard coat film formed using the curable resin composition; and a production method for the hard coat film. Thus, provided are a curable resin composition which makes it possible to form cured layer having excellent abrasion resistance, a hard coat film formed using the curable resin composition, and a production method for the hard coat film.

Inventors:
KATO TAKAHIRO (JP)
KITAMURA TETSU (JP)
WATANABE SOICHIRO (JP)
YOSHIMASA KEISUKE (JP)
MATSUMOTO AYAKO (JP)
TAMURA AKIO (JP)
Application Number:
PCT/JP2022/021816
Publication Date:
December 15, 2022
Filing Date:
May 27, 2022
Export Citation:
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Assignee:
FUJIFILM CORP (JP)
International Classes:
C08F299/00; B32B27/30; C08F220/24; C08F220/32; G02B1/14
Domestic Patent References:
WO2018062077A12018-04-05
WO2020175337A12020-09-03
WO2021039803A12021-03-04
WO2022004746A12022-01-06
Foreign References:
JP2007056221A2007-03-08
JP2008298859A2008-12-11
JP2009096990A2009-05-07
JP2010047680A2010-03-04
Attorney, Agent or Firm:
KOH-EI PATENT FIRM, P.C. (JP)
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