Title:
CURABLE RESIN COMPOSITION AND INTERLAYER INSULATING MATERIAL
Document Type and Number:
WIPO Patent Application WO/2023/032723
Kind Code:
A1
Abstract:
The present invention provides a curable resin composition excellent in terms of dielectric characteristics after curing and adhesiveness. Also provided is an interlayer insulating material obtained from the curable resin composition. This curable resin composition comprises a curable resin, a hardener, an inorganic filler, and a dispersant and has a complex viscosity, as measured at 90°C, 5% strain, and 1 rad/sec, of 8,000 Pa·s or less.
Inventors:
MASUI RYOHEI (JP)
TAKEDA KOHEI (JP)
HAYASHI TATSUSHI (JP)
OATARI YUTA (JP)
KAMAGA KEI (JP)
WAKIOKA SAYAKA (JP)
TAKEDA KOHEI (JP)
HAYASHI TATSUSHI (JP)
OATARI YUTA (JP)
KAMAGA KEI (JP)
WAKIOKA SAYAKA (JP)
Application Number:
PCT/JP2022/031479
Publication Date:
March 09, 2023
Filing Date:
August 22, 2022
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
C08L101/00; C08K3/013
Foreign References:
| JP2021070748A | 2021-05-06 | |||
| JP2020522593A | 2020-07-30 | |||
| JP2013241321A | 2013-12-05 | |||
| JP2015065368A | 2015-04-09 |
Attorney, Agent or Firm:
WISEPLUS IP FIRM (JP)
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