Title:
CURABLE RESIN COMPOSITION, LAMINATED STRUCTURE, CURED PRODUCT, AND ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2022/210945
Kind Code:
A1
Abstract:
[Problem] To provide a curable resin composition that has good resolution in a resultant dried coating film and exhibits minimal adhesion even if cured products are stacked after heat curing and stored in a high temperature environment. [Solution] A curable resin composition that enables alkaline development and forms a cured film when subjected to exposure and heat treatment. If a dried coating film having a thickness of 2–100 μm is formed from this curable resin composition, the arithmetic mean roughness Ra of the dried coating film is less than 0.1 μm, and the arithmetic mean roughness Ra of a cured film obtained by heat curing the dried coating film is 0.1–1 μm. This curable resin composition has characteristics such that the obtained dried coating film has good resolution, and there is minimal adhesion even if cured products are stacked after heat curing and stored in a high temperature environment. [Selected drawing] None
Inventors:
ODAGIRI YUTO (JP)
YOKOYAMA YUTAKA (JP)
KOIKE NAOYUKI (JP)
YONEDA KAZUYOSHI (JP)
MIYABE HIDEKAZU (JP)
YOKOYAMA YUTAKA (JP)
KOIKE NAOYUKI (JP)
YONEDA KAZUYOSHI (JP)
MIYABE HIDEKAZU (JP)
Application Number:
PCT/JP2022/016206
Publication Date:
October 06, 2022
Filing Date:
March 30, 2022
Export Citation:
Assignee:
TAIYO INK MFG CO LTD (JP)
International Classes:
C08G59/40; C08G73/10; C08G73/14; C08K5/16; C08L1/08; C08L63/00; C08L79/08; C08L101/00; G03F7/004; G03F7/038; H05K1/03
Foreign References:
| JP2009237057A | 2009-10-15 | |||
| JP2019001967A | 2019-01-10 | |||
| JP2009275114A | 2009-11-26 |
Attorney, Agent or Firm:
ETOH Toshiaki et al. (JP)
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