Title:
CURABLE RESIN COMPOSITION AND METHOD FOR MANUFACTURING SEMICONDUCTOR COMPONENT
Document Type and Number:
WIPO Patent Application WO/2023/176778
Kind Code:
A1
Abstract:
A purpose of the present invention is to provide a curable resin composition from which it is possible to obtain a cured product having superior ability for retaining a gap between a wafer and a cover glass. Another purpose of the present invention is to provide a method for manufacturing a semiconductor component using the curable resin composition. A curable resin composition according to the present invention is used for pasting together a wafer and a cover glass and contains a curable resin, a photoinitiator, and a thermosetting agent. The curable resin contains: a compound (A) that has a thermally polymerizable functional group that can react through the action of the thermosetting agent induced by heat; and a compound (B) that does not have the thermally polymerizable functional group but has a photopolymerizable functional group that can react through the action of the photoinitiator induced by irradiation with light.
Inventors:
UCHINO SHINYA (JP)
Application Number:
PCT/JP2023/009631
Publication Date:
September 21, 2023
Filing Date:
March 13, 2023
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
H01L23/10; C08F2/44; C08F290/06
Foreign References:
| JP2017066313A | 2017-04-06 | |||
| JP2020097746A | 2020-06-25 | |||
| JP2019183165A | 2019-10-24 | |||
| JP2016094579A | 2016-05-26 |
Attorney, Agent or Firm:
WISEPLUS IP FIRM (JP)
Download PDF:
Previous Patent: TRANSMISSION CONTROL DEVICE, TRANSMISSION CONTROL METHOD, AND PROGRAM
Next Patent: ELECTROCARDIOGRAPHIC EXAMINATION METHOD
Next Patent: ELECTROCARDIOGRAPHIC EXAMINATION METHOD