Title:
CURABLE RESIN COMPOSITION, PREPREG, AND CURED PRODUCT OF SAME
Document Type and Number:
WIPO Patent Application WO/2022/181758
Kind Code:
A1
Abstract:
The present invention provides: a curable resin composition having excellent heat resistance, copper foil peel strength, dielectric properties and moisture resistance; and a cured product of the curable resin composition. Provided is a curable resin composition comprising a maleimide compound (A) represented by formula (1) and a polyphenyleneether compound (B) having an unsaturated double bond, in which the ratio of the weight of the component (A) to the weight of the component (B) is 50/50 to 5/95. (In formula (1), R represents a hydrogen atom or a methyl group, m represents an integer of 0 to 3, and n represents the number of repetitions in which the average value of n satisfies the formula: 1 < n < 5.)
Inventors:
SEKI MASATO (JP)
HASHIMOTO MASANORI (JP)
HIJIKATA DAICHI (JP)
HASHIMOTO MASANORI (JP)
HIJIKATA DAICHI (JP)
Application Number:
PCT/JP2022/007840
Publication Date:
September 01, 2022
Filing Date:
February 25, 2022
Export Citation:
Assignee:
NIPPON KAYAKU KK (JP)
International Classes:
C08F299/02; C08J5/24
Domestic Patent References:
| WO2020054601A1 | 2020-03-19 | |||
| WO2019230945A1 | 2019-12-05 | |||
| WO2018159080A1 | 2018-09-07 | |||
| WO2020004211A1 | 2020-01-02 | |||
| WO2019172342A1 | 2019-09-12 | |||
| WO2021149733A1 | 2021-07-29 |
Foreign References:
| JP2019172725A | 2019-10-10 | |||
| JP2008510059A | 2008-04-03 | |||
| JP2018028078A | 2018-02-22 | |||
| JP2021116423A | 2021-08-10 |
Attorney, Agent or Firm:
KIUCHI Mitsuharu et al. (JP)
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