Title:
CURABLE RESIN COMPOSITION AND PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2010/113478
Kind Code:
A1
Abstract:
Disclosed is a curable resin composition which has good workability and high sensitivity, and is capable of providing a cured product thereof with high reliability when the cured product is used, for example, in a printed wiring board or a semiconductor package. Also disclosed is a cured product of the curable resin composition.
The curable resin composition contains a photopolymerization initiator and a carboxyl group-containing photosensitive resin which is obtained by reacting a polybasic acid anhydride with a reaction product that is obtained by reacting an unsaturated group-containing monocarboxylic acid with a reaction product that is obtained by reacting a phenol resin having a specific skeleton with an alkylene oxide or a cyclocarbonate compound.
Inventors:
ITO NOBUHITO (JP)
ARIMA MASAO (JP)
ARIMA MASAO (JP)
Application Number:
PCT/JP2010/002305
Publication Date:
October 07, 2010
Filing Date:
March 30, 2010
Export Citation:
Assignee:
TAIYO INK MFG CO LTD (JP)
ITO NOBUHITO (JP)
ARIMA MASAO (JP)
ITO NOBUHITO (JP)
ARIMA MASAO (JP)
International Classes:
G03F7/027; C08F290/06; C08G8/32; C08G59/42
Domestic Patent References:
| WO2003078494A1 | 2003-09-25 |
Foreign References:
| JP2004359729A | 2004-12-24 |
Attorney, Agent or Firm:
OTA, YOKO (JP)
Yoko Ota (JP)
Yoko Ota (JP)
Download PDF:
Previous Patent: SENSOR HAVING COVER AND METHOD FOR MANUFACTURING THE SENSOR
Next Patent: IMAGE PROCESSING APPARATUS AND METHOD AND PROGRAM
Next Patent: IMAGE PROCESSING APPARATUS AND METHOD AND PROGRAM