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Title:
CURABLE RESIN COMPOSITION, RESIN PROTECTIVE FILM, ORGANIC OPTICAL DEVICE, AND BARRIER FILM
Document Type and Number:
WIPO Patent Application WO/2014/119717
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a curable resin composition which enables the formation of a resin film that does not undergo the generation of an outgas and has excellent adhesion performance, heat resistance and reliability. The present invention also addresses the problem of providing a resin protective film, an organic optical device and a barrier film, each of which can be produced using the curable resin composition. The present invention is a curable resin composition comprising a (meth)acrylic compound having at least one (meth)acryloyl group per molecule, a polythiol compound having at least two thiol groups per molecule, a polyene compound having at least two carbon-carbon double bonds per molecule, and a photopolymerization initiator, wherein the polyene compound comprises a polyallyl compound and/or a polyvinyl compound.

Inventors:
SHICHIRI TOKUSHIGE (JP)
SON EUN-CHEOL (JP)
WATANABE YASUO (JP)
TERAGUCHI YUMIKO (JP)
Application Number:
PCT/JP2014/052230
Publication Date:
August 07, 2014
Filing Date:
January 31, 2014
Export Citation:
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Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
C08G75/02; H01L51/50; H05B33/04
Foreign References:
JP2012233048A2012-11-29
JP2012233047A2012-11-29
JP2003226718A2003-08-12
JPH0593069A1993-04-16
JPH0374407A1991-03-29
JPS63207805A1988-08-29
JPH1060114A1998-03-03
Attorney, Agent or Firm:
YASUTOMI & Associates (JP)
Patent business corporation Yasutomi international patent firm (JP)
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