Title:
CURABLE RESIN COMPOSITION FOR RELEASE SHEET, RELEASE SHEET, PROCESSING BASE MATERIAL USING SAME, AND METHOD FOR PROTECTING BASE MATERIAL
Document Type and Number:
WIPO Patent Application WO/2017/110472
Kind Code:
A1
Abstract:
A curable resin composition for a release sheet containing (A) a polyfunctional thiol compound having a weight average molecular weight of 200-2000 and (B) a polyfunctional (meth)acrylate having a weight average molecular weight of 200-50,000, in which the mass ratio ((A)/(B)) of component (A) and component (B) is 0.05-30, a processing base material using the same, and a method for protecting a base material.
Inventors:
KODA KAZUHIRO (JP)
FUJIMURA TOSHINOBU (JP)
TSUCHIYA HIROMITSU (JP)
FUJIMURA TOSHINOBU (JP)
TSUCHIYA HIROMITSU (JP)
Application Number:
PCT/JP2016/086353
Publication Date:
June 29, 2017
Filing Date:
December 07, 2016
Export Citation:
Assignee:
NOF CORP (JP)
International Classes:
C09D4/02; B32B27/00; C08G75/045; C08J5/18; C09D5/20
Domestic Patent References:
| WO2013073364A1 | 2013-05-23 |
Foreign References:
| JPS61207476A | 1986-09-13 | |||
| JPH03297638A | 1991-12-27 | |||
| JPH10110035A | 1998-04-28 |
Attorney, Agent or Firm:
OKADA PATENT & TRADEMARK OFFICE, P. C. (JP)
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