Title:
CURABLE RESIN COMPOSITION, RESIN SHEET, AND CURED PRODUCT OF SAME
Document Type and Number:
WIPO Patent Application WO/2023/171592
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a resin composition which enables the achievement of a cured product that has high heat resistance and low dielectric characteristics. The present invention provides a curable resin composition which contains (A) a compound which has at least two styrene structures in each molecule, (B) an epoxy resin and (C) an active ester compound.
Inventors:
TOHJIMA TAKAYUKI (JP)
HASHIMOTO MASANORI (JP)
NAKANISHI MASATAKA (JP)
HASHIMOTO MASANORI (JP)
NAKANISHI MASATAKA (JP)
Application Number:
PCT/JP2023/008217
Publication Date:
September 14, 2023
Filing Date:
March 06, 2023
Export Citation:
Assignee:
NIPPON KAYAKU KK (JP)
International Classes:
C08G73/00
Domestic Patent References:
| WO2019230944A1 | 2019-12-05 | |||
| WO2020054601A1 | 2020-03-19 |
Foreign References:
| JP2014129521A | 2014-07-10 | |||
| JPH03229717A | 1991-10-11 | |||
| JPS62223230A | 1987-10-01 |
Attorney, Agent or Firm:
MIKAMI Yoko (JP)
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