Title:
CURABLE RESIN COMPOSITION FOR STEREOLITHOGRAPHY, CURED PRODUCT, AND THREE-DIMENSIONAL OBJECT
Document Type and Number:
WIPO Patent Application WO/2022/209689
Kind Code:
A1
Abstract:
The present invention provides a curable resin composition for stereolithography, the resin composition containing a urethane resin (A) having a (meth)acryloyl group and a photopolymerization initiator, wherein the amount of the (meth)acryloyl group contained in the urethane resin (A) is 0.8-2.2 mmol/g. This curable resin composition for stereolithography has a low viscosity and is also capable of forming a cured product having excellent impact resistance with a high elastic modulus and impact strength, and less deterioration over time.
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Inventors:
SHIMIZU IKUMA (JP)
DEGUCHI YOSHINOBU (JP)
DEGUCHI YOSHINOBU (JP)
Application Number:
PCT/JP2022/010456
Publication Date:
October 06, 2022
Filing Date:
March 10, 2022
Export Citation:
Assignee:
DAINIPPON INK & CHEMICALS (JP)
International Classes:
B29C64/124; C08F290/06; B29C64/264; B33Y70/00; B33Y80/00; C08F299/06; C08G18/67; C08G18/78; C08G18/79
Domestic Patent References:
| WO2016072356A1 | 2016-05-12 |
Foreign References:
| JP2012111226A | 2012-06-14 | |||
| JPH09169827A | 1997-06-30 | |||
| JP2017210539A | 2017-11-30 | |||
| JPH07228644A | 1995-08-29 | |||
| JP2008189782A | 2008-08-21 |
Attorney, Agent or Firm:
OGAWA Shinji (JP)
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