Title:
CURABLE RESIN COMPOSITION FOR USE IN SEALING MATERIAL FOR FILM LIQUID CRYSTAL PANEL, AND FILM LIQUID CRYSTAL PANEL HAVING END SEALED BY SAID CURABLE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2024/070847
Kind Code:
A1
Abstract:
This curable resin composition for use in a sealing material for film liquid crystal panels comprises (A) a polyfunctional thiol compound, (B) a polyfunctional urethane (meth)acrylate compound, (C) a polyfunctional (meth)allyl compound, (D) a monofunctional (meth)allyl compound, and (E) a photopolymerization initiator, wherein the (B)/[(C) + (D)] mass ratio is 0.1-1.0, the (C)/(D) mass ratio is 0.3-3.0, and the ratio (thiol group/polymerizable unsaturated bond) between the functional group concentration of the thiol groups in (A) and the total of the functional group concentrations of the polymerizable unsaturated bonds in (B) to (D) is 0.4-3.0. This curable resin composition exhibits an excellent usability while in an uncured condition, does not contaminate liquid crystals even when brought into contact with liquid crystals, and does not produce perturbations in liquid crystal alignment even when in contact with liquid crystals in a severe environment of heat and moisture. In addition, this curable resin composition can be used in a sealing material for film liquid crystal panels that exhibits an excellent shock resistance and an excellent adherence to film substrates.
Inventors:
KOMATSUZAKI SATORU (JP)
Application Number:
PCT/JP2023/034095
Publication Date:
April 04, 2024
Filing Date:
September 20, 2023
Export Citation:
Assignee:
NOF CORP (JP)
International Classes:
G02F1/1339; C09K3/10; G02F1/1341
Foreign References:
| JP2017054084A | 2017-03-16 | |||
| JP2019178225A | 2019-10-17 |
Attorney, Agent or Firm:
UNIUS PATENT ATTORNEYS OFFICE (JP)
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