Title:
CURABLE RESIN COMPOSITION, VARNISH, PREPREG, AND CURED PRODUCT
Document Type and Number:
WIPO Patent Application WO/2023/089982
Kind Code:
A1
Abstract:
The present invention addresses the problem of overcoming issues caused by volatilization of a curing agent during heat curing and issues regarding deterioration in performance of a cured product associated with reduction in the usage amount of a curing agent; and providing a curable resin composition and a prepreg for obtaining a cured product having a significantly improved heat resistance. As a solution to the problem, provided is a curable resin composition containing: a component (A) in an amount of 100 parts by weight; and a component (B) in a range of 1.5-6.0 parts by weight. (A): A polyphenylene ether resin
(B): An allyl group-containing compound represented by general formula (1).
Inventors:
NASU AKIHITO (JP)
YOSHII TAKERU (JP)
WATANABE KENTARO (JP)
YOSHII TAKERU (JP)
WATANABE KENTARO (JP)
Application Number:
PCT/JP2022/037637
Publication Date:
May 25, 2023
Filing Date:
October 07, 2022
Export Citation:
Assignee:
HONSHU CHEMICAL IND (JP)
International Classes:
C08F2/44; C08L71/12; C08F12/34; C08F283/08; C08J5/24; C08K5/13
Domestic Patent References:
| WO2019188331A1 | 2019-10-03 |
Foreign References:
| JP2018062568A | 2018-04-19 | |||
| JP2020519707A | 2020-07-02 | |||
| KR20190004131A | 2019-01-11 | |||
| CN108250716A | 2018-07-06 | |||
| CN109232881A | 2019-01-18 | |||
| CN111909371A | 2020-11-10 |
Attorney, Agent or Firm:
YAMADA, Yasuyuki et al. (JP)
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