Title:
CURABLE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2004/009708
Kind Code:
A1
Abstract:
A curable resin composition which is excellent in heat resistance, mechanical properties, and adhesion and is capable of forming a film having improved flame retardancy. The curable resin composition comprises a thermosetting resin having dihydrobenzoxazine rings and a polyimide resin in a weight ratio of from 5&sol 95 to 95&sol 5.
Inventors:
FURUKAWA NOBUYUKI (JP)
Application Number:
PCT/JP2002/007360
Publication Date:
January 29, 2004
Filing Date:
July 19, 2002
Export Citation:
Assignee:
NIPPON STEEL CHEMICAL CO (JP)
FURUKAWA NOBUYUKI (JP)
FURUKAWA NOBUYUKI (JP)
International Classes:
C08L79/04; C08L79/08; H05K1/03; (IPC1-7): C08L79/08
Foreign References:
| JPH11282155A | 1999-10-15 | |||
| JPH10130460A | 1998-05-19 | |||
| GB1437814A | 1976-06-03 |
Attorney, Agent or Firm:
Naruse, Katsuo (Central Shinbashi Bldg. 11-5, Nishi-shinbashi 2-chom, Minato-ku Tokyo, JP)
Download PDF: