Title:
CURABLE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2010/128602
Kind Code:
A1
Abstract:
A curable resin composition comprising: a curable resin (A) containing a hydrolysable silyl group represented by formula (1) in the molecule; a curable resin (B) containing a hydrolysable silyl group represented by formula (2) in the molecule; a basic compound (C); and a non-tin curing catalyst (D). -X-SiR1
a(OR2)3-a ··· Formula (1) (In formula (1), X represents a hydrocarbon group having 2 or more carbon atoms; R1 represents a hydrocarbon group having 1 to 20 carbon atoms; R2 represents a group selected from organic groups each having 1 to 20 carbon atoms; and a represents 0, 1 or 2.) -W-CH2-SiR3
b(OR4)3-b ··· Formula (2) (In formula (2), W represents a binding functional group composed of a methylene group that can bind to a silicon atom contained in a hydrolysable silyl group and a hetero atom having an unshared electron pair and bound to the methylene group; R3 represents a hydrocarbon group having 1 to 20 carbon atoms; R4 represents a group selected from organic groups each having 1 to 20 carbon atoms; and b represents 0, 1 or 2.)
Inventors:
SATO SHINICHI
FUJIMOTO HIROYUKI
NOMURA YUKIHIRO
FUJIMOTO HIROYUKI
NOMURA YUKIHIRO
Application Number:
PCT/JP2010/050940
Publication Date:
November 11, 2010
Filing Date:
January 26, 2010
Export Citation:
Assignee:
KONISHI CO LTD (JP)
SATO SHINICHI
FUJIMOTO HIROYUKI
NOMURA YUKIHIRO
SATO SHINICHI
FUJIMOTO HIROYUKI
NOMURA YUKIHIRO
International Classes:
C08L101/10; C08K5/544; C09J11/06; C09J133/14; C09J171/02; C09K3/10
Foreign References:
| JP2006199730A | 2006-08-03 | |||
| JP2006052296A | 2006-02-23 | |||
| JP2008522991A | 2008-07-03 | |||
| JP2008523177A | 2008-07-03 | |||
| JP2005535779A | 2005-11-24 |
Attorney, Agent or Firm:
TSUKUNI, HAJIME (JP)
Hajime Tsukuni (JP)
Hajime Tsukuni (JP)
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