Title:
CURABLE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2011/027526
Kind Code:
A1
Abstract:
Provided is a curable resin composition which exhibits improved developability even in through holes and can suppress the generation of development residue and which can yield a cured product with excellent heat resistance and hardness. A curable resin composition which comprises a carboxyl-containing resin, a photopolymerization initiator, and barium sulfate that has been pretreated with a dispersant having an acid group and/or a dispersant having a block copolymer structure, a graft polymer structure, and/or a star polymer structure.
Inventors:
SHIINA MOMOKO (JP)
ARIMA MASAO (JP)
YAMAMOTO SHUICHI (JP)
YOSHIDA MASATO (JP)
ARIMA MASAO (JP)
YAMAMOTO SHUICHI (JP)
YOSHIDA MASATO (JP)
Application Number:
PCT/JP2010/005301
Publication Date:
March 10, 2011
Filing Date:
August 27, 2010
Export Citation:
Assignee:
TAIYO HOLDINGS CO LTD (JP)
SHIINA MOMOKO (JP)
ARIMA MASAO (JP)
YAMAMOTO SHUICHI (JP)
YOSHIDA MASATO (JP)
SHIINA MOMOKO (JP)
ARIMA MASAO (JP)
YAMAMOTO SHUICHI (JP)
YOSHIDA MASATO (JP)
International Classes:
C08F290/00; C08G59/17; C08G59/58; G03F7/004; G03F7/027; H05K3/28
Foreign References:
| JP2009265297A | 2009-11-12 | |||
| JP2009265298A | 2009-11-12 | |||
| JPH05140208A | 1993-06-08 |
Attorney, Agent or Firm:
AMAGI INTERNATIONAL PATENT LAW OFFICE (JP)
Patent business corporation Amagi international patent firm (JP)
Patent business corporation Amagi international patent firm (JP)
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