Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
CURABLE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2011/040407
Kind Code:
A1
Abstract:
Disclosed is a curable resin composition which contains the following components (A) to (C) and shows a high adhesive strength: (A) one or more compounds selected from the group consisting of (a-1) a polymer having one or more (meth)acryloyl groups at an end or a side chain of the molecule and also having a diene-based skeleton or a hydrogenated diene-based skeleton, (a-2) an elastomer, and (a-3) a copolymerized polyester; (B) a (meth)acrylate having fluorine; and (C) a polymerization initiator. The curable resin composition may further contain (D) a (meth)acrylate other than the components (A) and (B) and (E) a silane coupling agent. The component (B) is preferably a (meth)acrylic acid ester having, as an ester residue, a fluoroalkyl group having 2 to 8 carbon atoms.

Inventors:
HISHA YUKI (JP)
WATANABE JUN (JP)
Application Number:
PCT/JP2010/066839
Publication Date:
April 07, 2011
Filing Date:
September 28, 2010
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
DENKI KAGAKU KOGYO KK (JP)
HISHA YUKI (JP)
WATANABE JUN (JP)
International Classes:
C08F290/06; C08F2/44; C09J4/00; C09J4/02; C09J5/00; C09J11/06; C09J11/08; C09J109/00; C09J167/00; H01L31/042
Domestic Patent References:
WO2009063945A12009-05-22
Foreign References:
JP2002164360A2002-06-07
JP2002184793A2002-06-28
JPS62146278A1987-06-30
JPS6189264A1986-05-07
JP2008195789A2008-08-28
JP2009235205A2009-10-15
Attorney, Agent or Firm:
AXIS Patent International (JP)
Axis international patent business corporation (JP)
Download PDF: