Title:
CURABLE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2011/090046
Kind Code:
A1
Abstract:
Disclosed is a curable resin composition which can be reduced in the burden on the environment, while securing safety and having extremely high curability at low temperatures.
Specifically disclosed is a curable resin composition which contains: a curable resin (A) that has a crosslinkable silicon group in each molecule, said crosslinkable silicon group having a chemical structure wherein a carbon atom is bonded to a silicon atom in the crosslinkable silicon group and a heteroatom having an unshared electron pair is bonded to the carbon atom; a curable resin (B) that has a crosslinkable silicon group in each molecule and a main chain composed of a vinyl polymer, said crosslinkable silicon group having a structure wherein an alkylene group having two or more carbon atoms is bonded to a silicon atom; and a basic compound (C). The curable resin composition is characterized in that the (mass) ratio of the curable resin (A) to the curable resin (B) is from 5:95 to 95:5, and the basic compound (C) is contained in an amount of 0.1-30 parts by mass relative to 100 parts by mass of the total of the curable resin (A) and the curable resin (B).
Inventors:
NOMURA YUKIHIRO
SATO SHINICHI
SATO SHINICHI
Application Number:
PCT/JP2011/050814
Publication Date:
July 28, 2011
Filing Date:
January 19, 2011
Export Citation:
Assignee:
KONISHI CO LTD (JP)
NOMURA YUKIHIRO
SATO SHINICHI
NOMURA YUKIHIRO
SATO SHINICHI
International Classes:
C08L101/10; C08K5/00; C08L71/02; C09J11/06; C09J143/04; C09J157/00; C09J171/00; C09J201/02; C09J201/10; C09K3/10
Foreign References:
| JP2005281495A | 2005-10-13 | |||
| JP2005139452A | 2005-06-02 | |||
| JP2005054174A | 2005-03-03 | |||
| JP2006199905A | 2006-08-03 | |||
| JP2005501146A | 2005-01-13 | |||
| JP2004518801A | 2004-06-24 |
Attorney, Agent or Firm:
NAITO TERUO (JP)
Teruo Naito (JP)
Teruo Naito (JP)
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Claims: