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Patent Searching and Data


Title:
CURABLE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2016/190158
Kind Code:
A1
Abstract:
Curable resin compositions wherein a polyfunctional thiol compound and a specific thioether-containing alkoxysilane derivative are mixed with an epoxy resin composition and a polyfunctional polyene that has a plurality of double bonds have excellent adhesion to inorganic substrates and, as resin compositions, have excellent storage stability. However, cured films of such compositions have poor flexibility in cold places and, as a result, crack easily when bent. Said cured films also have poor adhesion. The present invention provides a material that has excellent adhesion to substrates, even in cold places, and that can produce a flexible cured film. A curable resin composition that contains (A) a thioether-containing (meth)acrylate derivative that has a specific structure and (B) a polyfunctional (meth)acrylate that has a weight average molecular weight of 200-50,000. The mass ratio ((A)/(B)) of the (A) component and the (B) component is 0.05-30.

Inventors:
KODA KAZUHIRO (JP)
TASHIRO HIROSHI (JP)
FUJIMURA TOSHINOBU (JP)
Application Number:
PCT/JP2016/064515
Publication Date:
December 01, 2016
Filing Date:
May 16, 2016
Export Citation:
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Assignee:
NOF CORP (JP)
International Classes:
C08G75/04; C08F2/38; C08F2/44; C08F2/48
Domestic Patent References:
WO2014203779A12014-12-24
WO2015186617A12015-12-10
Foreign References:
JP2012246464A2012-12-13
JP2013216825A2013-10-24
Other References:
SHIN,J. ET AL.: "Effects of Chemical Modification of Thiol-Ene Networks on Enthalpy Relaxation", MACROMOLECULES, vol. 42, no. 17, 2009, pages 6549 - 6557, XP055240111
KWISNEK,L. ET AL.: "Oxygen Transport Properties of Thiol-Ene Networks", MACROMOLECULES, vol. 42, no. 18, 2009, pages 7031 - 7041, XP055240110
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