Title:
CURABLE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2017/203783
Kind Code:
A1
Abstract:
The present invention pertains to a curable composition which simultaneously ensures adhesive strength to an inorganic substrate and an organic substrate, and which is characterized by containing a (meth)acrylic oligomer (component A) having a molecular weight of 5,000 or more, a (meth)acrylic monomer (component B), and at least one radical polymerization initiator (component C) selected from the group consisting of photo-radical polymerization initiators and thermal-radical polymerization initiators, and having a viscosity of 150 mPa·s or less.
Inventors:
AONO TOMOSHI (JP)
Application Number:
PCT/JP2017/008152
Publication Date:
November 30, 2017
Filing Date:
March 01, 2017
Export Citation:
Assignee:
KYORITSU CHEMICAL & CO LTD (JP)
International Classes:
C08F290/06; C09J4/02; C09J11/06
Domestic Patent References:
| WO2009016943A1 | 2009-02-05 | |||
| WO2012141275A1 | 2012-10-18 |
Foreign References:
| JP2012214716A | 2012-11-08 | |||
| JP2009062433A | 2009-03-26 | |||
| JP2015117266A | 2015-06-25 |
Attorney, Agent or Firm:
TSUKUNI & ASSOCIATES et al. (JP)
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