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Title:
CURABLE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2020/203750
Kind Code:
A1
Abstract:
The present invention provides a curable resin composition which has excellent heat resistance and oxygen barrier properties, and which is capable of forming a cured body that is suitable for a resin member of an electronic device such as an organic EL device, a high luminance LED and a solar cell. A curable resin composition which contains the following components (A)-(D):　(A) an epoxy resin containing a nitrogen atom; (B) a siloxane compound having an epoxy group; (C) an inorganic filler; and (D) a curing agent.

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Inventors:
SATO TAIGA (JP)
OHASHI SATORU (JP)
KUBO YUKI (JP)
Application Number:
PCT/JP2020/013979
Publication Date:
October 08, 2020
Filing Date:
March 27, 2020
Export Citation:
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Assignee:
AJINOMOTO KK (JP)
International Classes:
C08G59/20; C08K3/013; C08L63/06
Domestic Patent References:
WO2014038446A12014-03-13
Foreign References:
JP2017155145A2017-09-07
JP2008156475A2008-07-10
JPH0797434A1995-04-11
Attorney, Agent or Firm:
TAKASHIMA, Hajime (JP)
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