Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
CURABLE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2022/168666
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a curable resin composition having an excellent balance between curability and storage stability. The curable resin composition according to the present invention contains: (A) an epoxy resin; (B) a curing agent; and (C) at least one selected from imide compounds represented by formulae (1-1), (1-2), and (1-3). In the formulae, R11 represents an alkyl group or the like having 1-10 carbon atom and optionally having a substituent group, R1-R4 each independently represent a hydrogen atom, an alkyl group having 1-10 carbon atoms, or the like, and R12 and R13 each independently represent a hydrogen atom, an alkyl group having 1-10 carbon atoms and optionally having a substituent group, or the like.

Inventors:
ENDO TAKESHI (JP)
MORI YASUYUKI (JP)
TAMASO KEN-ICHI (JP)
OGAWA RYO (JP)
UEYAMA JUNJI (JP)
Application Number:
PCT/JP2022/002587
Publication Date:
August 11, 2022
Filing Date:
January 25, 2022
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
ADEKA CORP (JP)
International Classes:
C08G59/56
Foreign References:
JP2011219740A2011-11-04
JP2018090660A2018-06-14
JP2019038989A2019-03-14
US4066625A1978-01-03
JP2007297493A2007-11-15
Other References:
"Polymer Chemistry", JOURNAL OF POLYMER SCIENCE, vol. 54, 2016, pages 2680 - 2688
"Polymer Chemistry", JOURNAL OF POLYMER SCIENCE, vol. 56, 2018, pages 471 - 474
COMPOSITES, vol. 17, no. 107, 2019, pages 380
MATERIALS LETTERS, vol. 234, 2019, pages 379 - 383
Attorney, Agent or Firm:
SHOWA INTERNATIONAL PATENT FIRM (JP)
Download PDF: