Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
CURABLE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2022/185832
Kind Code:
A1
Abstract:
The present invention relates to an epoxy resin composition having excellent low-temperature curability and excellent permeability through narrow clearances. This epoxy resin composition contains components (A) through (C). Component (A) is a compound having two or more epoxy groups; component (B) is a silica treated by phenylaminosilane; and component (C) is a compound that cures component (A).

Inventors:
IWASAWA JYUNYA (JP)
Application Number:
PCT/JP2022/004398
Publication Date:
September 09, 2022
Filing Date:
February 04, 2022
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
THREE BOND CO LTD (JP)
International Classes:
C08G59/20; C08G59/50; C08G59/66; C08K3/36; C08K9/06; C08L63/00
Domestic Patent References:
WO2021033325A12021-02-25
WO2018079466A12018-05-03
Foreign References:
JP2019048952A2019-03-28
JP2021028367A2021-02-25
JP2014051621A2014-03-20
JP2002179884A2002-06-26
JP2017031268A2017-02-09
Attorney, Agent or Firm:
HATTA & ASSOCIATES (JP)
Download PDF:
View/Download PDF      PDF Help



 
Previous Patent: MOTOR SYSTEM AND MOTOR DRIVE METHOD

Next Patent: METHOD FOR PRODUCING COATED MEDICAL DEVICE