CURABLE RESIN COMPOSITION

WIPO Patent Application WO/2022/202939

A1

[Problem] To provide a curable resin composition that can be suitably used as a paste for coating or filling a printed wiring board having a high degree of wiring formation freedom, the curable resin composition making it possible to obtain a cured product with which it is possible to form a coating film with no variation and which has a high relative magnetic permeability that is stable over time. [Solution] This curable resin composition contains a thermosetting resin, a curing agent, magnetic powder, and a dilution component, the curable resin composition being characterized in that the thermosetting resin has a 5% weight loss temperature of more than 180 °C as determined by thermal gravimetric analysis and the dilution component has a 5% weight loss temperature of 50-180 °C as determined by thermal gravimetric analysis.

JP7003572	Solvent-free laminated adhesive, its cured product, laminate and package
WO/2013/172064	EPOXY/VINYL COPOLYMER-TYPE LIQUID RESIN COMPOSITION, CURED ARTICLE THEREOF, ELECTRICAL/ELECTRONIC DEVICE USING SAID CURED ARTICLE, AND METHOD FOR PRODUCING SAID CURED ARTICLE
WO/2024/062904	RESIN COMPOSITION, CURED PRODUCT, CAMERA MODULE, AND ELECTRONIC DEVICE

NOGUCHI TOMOTAKA (JP)
TAKAHASHI CHIKA (JP)
SHIMURA MASAYUKI (JP)

PCT/JP2022/013718

September 29, 2022

March 23, 2022

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TAIYO INK MFG CO LTD (JP)

C08G59/20; C08K3/08; C08L63/00; C08L101/00; H05K1/11; H05K3/40

WO2020022393A1

2020-01-30

CN106024359A	2016-10-12
JP2021161211A	2021-10-11

NAKAMURA Yukitaka et al. (JP)

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