CURABLE RESIN FILM, COMPOSITE SHEET, AND METHOD FOR MANUFACTURING SEMICONDUCTOR CHIP

Title:

CURABLE RESIN FILM, COMPOSITE SHEET, AND METHOD FOR MANUFACTURING SEMICONDUCTOR CHIP

Document Type and Number:

WIPO Patent Application WO/2021/132679

Kind Code:

A1

Abstract:

The present invention addresses the problem of providing a curable resin film with which it is possible to form a protective film having excellent coverage on the side surfaces and bump formation surface of a semiconductor chip. In order to overcome the aforesaid problem, the present invention provides a curable resin film that satisfies requirement (I) below and is used to form a cured resin film serving as a protective film on the side surfaces and bump formation surface of a semiconductor chip, the bump-formation surface having bumps provided thereon. A test piece of the curable resin film having a diameter of 25 mm and a thickness of 1 mm is subjected to strain at a temperature of 90°C and frequency of 1 Hz, and the storage elastic modulus of the test piece is measured. The value of X calculated using formula (i) below is at least 19 and less than 10,000, where Gc1 is the storage elastic modulus of the test piece when the strain of the test piece is 1% and Gc300 is the storage elastic modulus of the test piece when the strain of the test piece is 300%. Formula (i) X=Gc1/Gc300

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Inventors:

SHINODA TOMONORI (JP)
NEMOTO TAKU (JP)
TAMURA SAKURAKO (JP)
MORISHITA TOMOTAKA (JP)
SHINOMIYA KEISUKE (JP)

Application Number:

PCT/JP2020/049014

Publication Date:

July 01, 2021

Filing Date:

December 25, 2020

Export Citation:

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Assignee:

LINTEC CORP (JP)

International Classes:

B32B27/00; C08J5/18; H01L21/301; H01L21/56; H01L21/60; H01L23/29; H01L23/31

Domestic Patent References:

WO2017077957A1	2017-05-11
WO2019098329A1	2019-05-23

Foreign References:

JP2016076694A	2016-05-12
JP2008081734A	2008-04-10
JP2015207718A	2015-11-19
JP2019106420A	2019-06-27
US20150357256A1	2015-12-10

Attorney, Agent or Firm:

OHTANI PATENT OFFICE (JP)

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