Title:
CURABLE RESIN AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2014/112321
Kind Code:
A1
Abstract:
Provided are: a curable resin which has excellent curability, heat resistance and adhesion, and is suitable for various binder applications, especially binder applications for highly heat-resistant frame inks; and a method for producing the curable resin.
A curable resin which is obtained by reacting (a) a polyester that has a number average molecular weight of 500-10,000 and an acid value of 300 eq/t or less, (b) a silicone resin and (c) a specific silane compound, and which contains 0.1-30 unreacted alkoxy groups in each molecule.
Inventors:
KAWAKUSU TETSUO (JP)
Application Number:
PCT/JP2013/085048
Publication Date:
July 24, 2014
Filing Date:
December 27, 2013
Export Citation:
Assignee:
TOYO BOSEKI (JP)
International Classes:
C08G77/445; C08G63/91; C09D11/00; C09J183/10
Foreign References:
| JPH08183930A | 1996-07-16 | |||
| JPH0753723A | 1995-02-28 | |||
| JPH0753720A | 1995-02-28 | |||
| JP2000338720A | 2000-12-08 | |||
| JPH03210329A | 1991-09-13 | |||
| JPH06145359A | 1994-05-24 |
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