CURABLE SILICONE COMPOSITION, AND ADHESIVE

WIPO Patent Application WO/2022/172614

A1

The present invention is a curable silicone composition containing: (A) an organopolysiloxane which is an addition reaction product of (a) a compound represented by general formula (1) and (b) a compound represented by general formula (2), and has an average of at least four methacrylic groups in one molecule (p is an integer of at least 10, R1 is a monovalent organic group having 1-12 carbon atoms, and R2 is an alkenyl group having 2-12 carbon atoms.) (q is an integer of 0-20, R3 is a monovalent organic group having 1-12 carbon atoms, and Z1 is a divalent organic group having 1-10 carbon atoms.); (B) an organic peroxide; (C) an organohydrogenpolysiloxane; and (D) a platinum group metal catalyst. Accordingly, provided is a curable silicone composition which has excellent curability and does not cause poor curing or foaming even when an addition reaction catalytic poison or moisture is present on the surface of an adherend, and which is useful as an adhesive.

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KIMURA SHINJI (JP)
OZAI TOSHIYUKI (JP)

PCT/JP2021/047680

August 18, 2022

December 22, 2021

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SHINETSU CHEMICAL CO (JP)

C08L83/05; C08L83/07; C09J183/07

JP2004107577A	2004-04-08
JP2018076415A	2018-05-17
JP2019210351A	2019-12-12
JP2013203794A	2013-10-07
JP2016210861A	2016-12-15
JP4430470B2	2010-03-10
JP4314454B2	2009-08-19

YOSHIMIYA Mikio et al. (JP)

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