Title:
CURABLE SILICONE RESIN COMPOSITION AND CURED PRODUCT THEREOF, AND OPTICAL SEMICONDUCTOR DEVICE USING SAME
Document Type and Number:
WIPO Patent Application WO/2017/126199
Kind Code:
A1
Abstract:
The curable silicone resin composition according to the present invention contains at least component (A), component (B), and component (C).
Component (A): a predetermined silicone resin represented by formula [1] and having a viscosity of 10,000 cP or less.
Component (B): a predetermined silicone resin represented by formula [2] and having a viscosity of 10,000 cP or less.
Component (C): a hydrosilylated catalyst.
(H-SiMe2O1/2)a(Me2SiO2/2)b(PhSiO3/2)c(SiO4/2)d [1]
(Vi-SiMe2O1/2)e(Me2SiO2/2)f(PhSiO3/2)g(SiO4/2)h [2]
The curable silicone resin composition exhibits low viscosity and sufficient durability, and is useful as a sealing material for semiconductor elements in an optical semiconductor device.
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Inventors:
KAWAI WATARU (JP)
AKIYAMA KATSUHIRO (JP)
MATSUNO YU (JP)
SEINO MAKOTO (JP)
AKIYAMA KATSUHIRO (JP)
MATSUNO YU (JP)
SEINO MAKOTO (JP)
Application Number:
PCT/JP2016/083317
Publication Date:
July 27, 2017
Filing Date:
November 10, 2016
Export Citation:
Assignee:
CENTRAL GLASS CO LTD (JP)
International Classes:
C08L83/05; C08G77/06; C08K3/08; C08L83/07; C09J11/04; C09J11/06; C09J183/05; C09J183/07; H01L23/29; H01L23/31; H01L33/56
Domestic Patent References:
| WO2012029538A1 | 2012-03-08 |
Foreign References:
| JP2005105217A | 2005-04-21 | |||
| JP2012082300A | 2012-04-26 | |||
| JP2013067683A | 2013-04-18 | |||
| JP2010106223A | 2010-05-13 | |||
| JP2009215420A | 2009-09-24 | |||
| JP2013147659A | 2013-08-01 | |||
| JP2012144617A | 2012-08-02 |
Attorney, Agent or Firm:
KOBAYASHI, Hiromichi et al. (JP)
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