Title:
CURABLE THERMALLY CONDUCTIVE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2023/147698
Kind Code:
A1
Abstract:
A curable thermally conductive composition contains: (A) an alkenyl-functional polyorganosiloxane having a viscosity in a range of 25 to 2000 millipascal*seconds; (B) a silyl-hydride functional polysiloxane crosslinker; (C) from 94 to 97 weight-percent of thermally conductive fillers that contain (c1) from 30 to less than 55 weight-percent of aluminum particles having a D50 of 60 micrometers or more; (c2) from 20 to 40 weight-percent of thermally conductive fillers having a D50 of 1 to 10 micrometers; (c3) from 8 to 20 weight-percent of thermally conductive fillers having a D50 of 0.1 to less than 1 micrometer; and (c4) optionally, from zero to 20 weight-percent of thermally conductive fillers other than (c1), having a D50 of 20 to 80 micrometers; and (D) from 0.1 to 2.5 weight-percent of a filler treating agent comprising a trialkoxysilyl diorganopolysiloxane, and optionally, an alkyl trialkoxysilane; where weight-percentages are relative to curable thermally conductive composition weight.
Inventors:
ZHENG YAN (CN)
BHAGWAGAR DORAB (US)
BHAGWAGAR DORAB (US)
Application Number:
PCT/CN2022/075356
Publication Date:
August 10, 2023
Filing Date:
February 07, 2022
Export Citation:
Assignee:
DOW SILICONES CORP (US)
ZHENG YAN (CN)
BHAGWAGAR DORAB (US)
ZHENG YAN (CN)
BHAGWAGAR DORAB (US)
International Classes:
C08L83/05; C08L83/07; H01L23/36
Domestic Patent References:
| WO2021235214A1 | 2021-11-25 |
Foreign References:
| US20060100336A1 | 2006-05-11 | |||
| US3159601A | 1964-12-01 | |||
| US3220972A | 1965-11-30 |
Attorney, Agent or Firm:
SHANGHAI PATENT & TRADEMARK LAW OFFICE, LLC (CN)
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