Title:
CURABLE THERMOSETTING RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2017/041201
Kind Code:
A1
Abstract:
The present invention relates to a curable thermosetting resin composition comprising the following components: a multicomponent copolymer of monomers represented by general formulas (I), (II), (III) and (IV), an epoxy resin, a curing agent and the like. The present invention creatively introduces the phosphorus element into a ternary or quaternary copolymer which can undergo a cross-linking reaction with the epoxy resin and mixes with the epoxy resin and the like to form a composition, and at the same time meets the requirements that the cured product has a relatively high glass transition temperature, a relatively Low dielectric constant and dielectric loss factor and a certain flame retardance. It can be widely used in composite materials which require low dielectric properties such as printed circuit boards, high voltage insulators, mobile communication base station radomes and the like. There are two preparation methods for the multicomponent copolymer, one is a direct copolymerization method of corresponding monomers, and the other is a method of first copolymerization with a hydroxyl-containing monomer and then phosphate esterification.
Inventors:
LIU WEI (CN)
XIAO RUIMIN (CN)
WANG LU (CN)
XIAO RUIMIN (CN)
WANG LU (CN)
Application Number:
PCT/CN2015/000652
Publication Date:
March 16, 2017
Filing Date:
September 21, 2015
Export Citation:
Assignee:
CHANGZHOU BAMSTONE COMPOSITES CO LTD (CN)
International Classes:
C08L63/00; C08F8/40; C08F30/02; C08F212/08; C08F222/08; C08F222/40; C08L53/00
Domestic Patent References:
| WO2013000151A1 | 2013-01-03 |
Foreign References:
| EP0699724A1 | 1996-03-06 | |||
| JP2001019744A | 2001-01-23 | |||
| CN104650281A | 2015-05-27 |
Attorney, Agent or Firm:
SUZHOU MINGHAO PATENT AGENCY(GENERAL PARTNERSHIP) (CN)
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