Title:
CURED FILM AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2017/122623
Kind Code:
A1
Abstract:
Provided is a cured film having high chemical resistance, high elongation properties and high adhesion to copper metal.
A cured film which is obtained by curing a photosensitive resin composition containing a polybenzoxazole precursor, and which is characterized in that the ratio of the polybenzoxazole precursor that has been ring-closed to a polybenzoxazole is from 10% to 60% (inclusive).
Inventors:
SHOJI YU (JP)
MASUDA YUKI (JP)
ISOBE KIMIO (JP)
OKUDA RYOJI (JP)
MASUDA YUKI (JP)
ISOBE KIMIO (JP)
OKUDA RYOJI (JP)
Application Number:
PCT/JP2017/000442
Publication Date:
July 20, 2017
Filing Date:
January 10, 2017
Export Citation:
Assignee:
TORAY INDUSTRIES (JP)
International Classes:
C08G73/22; G03F7/023; G03F7/40
Domestic Patent References:
| WO2008111470A1 | 2008-09-18 | |||
| WO2010134207A1 | 2010-11-25 |
Foreign References:
| JP2012133091A | 2012-07-12 | |||
| JP2011084562A | 2011-04-28 | |||
| JP2007132978A | 2007-05-31 | |||
| JPH11158275A | 1999-06-15 |
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