Title:
CURED MOLDED ARTICLE
Document Type and Number:
WIPO Patent Application WO/2012/132469
Kind Code:
A1
Abstract:
A molded article formed from 20 to 99 wt% of biodegradable inorganic fibers comprising SiO2 and an alkaline earth metal, wherein the colloidal silica that serves as the curing agent penetrates from the surface of the molded article to obtain a molded article having a cured surface.
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Inventors:
KISHIKI TOMOHIKO (JP)
MIHARA TETSUYA (JP)
YONAIYAMA KEN (JP)
ISHIHARA TETSUYA (JP)
MIHARA TETSUYA (JP)
YONAIYAMA KEN (JP)
ISHIHARA TETSUYA (JP)
Application Number:
PCT/JP2012/002241
Publication Date:
October 04, 2012
Filing Date:
March 30, 2012
Export Citation:
Assignee:
NICHIAS CORP (JP)
KISHIKI TOMOHIKO (JP)
MIHARA TETSUYA (JP)
YONAIYAMA KEN (JP)
ISHIHARA TETSUYA (JP)
KISHIKI TOMOHIKO (JP)
MIHARA TETSUYA (JP)
YONAIYAMA KEN (JP)
ISHIHARA TETSUYA (JP)
International Classes:
C04B35/80; C04B41/68; D01F9/08; D04H1/4209; D06M11/79
Foreign References:
JP2007211958A | 2007-08-23 | |||
JP2002029865A | 2002-01-29 | |||
JP2000086361A | 2000-03-28 | |||
JP2008162853A | 2008-07-17 | |||
JP2006306713A | 2006-11-09 | |||
JP2007197870A | 2007-08-09 | |||
JPS4514897B1 | ||||
JP2002524384A | 2002-08-06 | |||
JP2008013402A | 2008-01-24 |
Other References:
See also references of EP 2692712A1
Attorney, Agent or Firm:
WATANABE, Kihei et al. (JP)
Kihei Watanabe (JP)
Kihei Watanabe (JP)
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Claims: