Title:
CURING AGENT COMPOSITION FOR EPOXY RESIN AND THERMOSETTING MOLDING MATERIAL
Document Type and Number:
WIPO Patent Application WO/2012/141174
Kind Code:
A1
Abstract:
The present invention relates in part to a curing agent composition for an epoxy resin, the composition being characterized in containing a novolac-type phenolic resin having a weight-average molecular weight (Mw) of 320-370 and having a dispersion degree [weight-average molecular weight (Mw)/number-average molecular weight (Mn)] of 1.02-1.05. The present invention can provide a curing agent composition for an epoxy resin having low melt viscosity and favorable blocking resistance, as well as a thermosetting molding material having superior heat resistance.
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Inventors:
MURATA REIKO (JP)
TSUIHIJI TAKESHI (JP)
TSUIHIJI TAKESHI (JP)
Application Number:
PCT/JP2012/059792
Publication Date:
October 18, 2012
Filing Date:
April 10, 2012
Export Citation:
Assignee:
GUN EI CHEMICAL INDUSTRY CO LTD (JP)
MURATA REIKO (JP)
TSUIHIJI TAKESHI (JP)
MURATA REIKO (JP)
TSUIHIJI TAKESHI (JP)
International Classes:
C08G59/62; C08G8/10
Foreign References:
JPS62212410A | 1987-09-18 | |||
JPH0195118A | 1989-04-13 | |||
JPS63254123A | 1988-10-20 | |||
JPH06192361A | 1994-07-12 | |||
JPH04189812A | 1992-07-08 | |||
JPH06239967A | 1994-08-30 |
Attorney, Agent or Firm:
SHIGA Masatake et al. (JP)
Masatake Shiga (JP)
Masatake Shiga (JP)
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Claims: