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Patent Searching and Data


Title:
CURING AGENT COMPOSITION FOR EPOXY RESINS, EPOXY RESIN COMPOSITION AND USE THEREOF
Document Type and Number:
WIPO Patent Application WO2003029322
Kind Code:
A9
Abstract:
An epoxy resin composition comprising (A) an epoxy resin, (B) a curing agent, and (C) a cure accelerator, wherein the curing agent (B) is a dihydric or higher phenol, an ester thereof, or a mixture of both and the cure accelerator (C) is a phosphazenium salt represented by the general formula (I): (I) wherein R<1>s may be the same or different and are each hydrogen, linear, branched or cyclic alkyl having 1 to 10 carbon atoms, or aryl or aralkyl having 6 to 10 carbon atoms; and Z<-> is a halide anion, a hydroxide anion, an alkoxide anion, an aryloxide anion, or a carboxylate anion.

Inventors:
MAEDA SUNAO (JP)
URAKAMI TATSUHIRO (JP)
KAWABATA TOMOYUKI (JP)
SUZUKI KOUTAROU (JP)
NOBORI TADAHITO (JP)
Application Number:
PCT/JP2002/009992
Publication Date:
November 13, 2003
Filing Date:
September 27, 2002
Export Citation:
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Assignee:
MITSUI CHEMICALS INC (JP)
MAEDA SUNAO (JP)
URAKAMI TATSUHIRO (JP)
KAWABATA TOMOYUKI (JP)
SUZUKI KOUTAROU (JP)
NOBORI TADAHITO (JP)
International Classes:
C08G59/62; C08G59/68; H01L23/29; (IPC1-7): C08G59/40; C08G59/62; C08G59/68; H01L23/29; C07F9/54
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