CURING AGENT COMPOSITION FOR EPOXY RESINS, EPOXY RESIN COMPOSITION, AND COATING MATERIAL

WIPO Patent Application WO/2022/054897

A1

The present invention provides: a curing agent composition for epoxy resins, said curing agent composition containing a component (A) that is a compound represented by general formula (1), and a component (B) that is at least one compound selected from the group consisting of compounds represented by general formula (2) and compounds represented by general formula (3), wherein the mass ratio of the component (A) to the component (B) is from 7:3 to 9:1; an epoxy resin composition which contains this curing agent composition for epoxy resins; and a coating material.　(In formula (1), each of R1 and R2 independently represents a hydrogen atom or a methyl group; each of X1 to X3 independently represents a residue that is obtained by removing two amino groups from a polyamine compound; and n represents an integer from 0 to 10.) (In formula (2), X4 represents a residue that is obtained by removing two amino groups from a polyamine compound.) (In formula (3), x represents an integer from 1 to 6; y represents an integer from 1 to 40; and z represents an integer from 1 to 6.)

SATO DAISUKE (JP)
AYA YOICHI (JP)

PCT/JP2021/033260

March 17, 2022

September 10, 2021

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ADEKA CORP (JP)

C08G59/60; C08L63/00; C09D5/02; C09D163/00

WO2017187346A1	2017-11-02
WO2018096868A1	2018-05-31

JP2015533862A	2015-11-26
JP2004042031A	2004-02-12
JP2003342084A	2003-12-03
JP2006052240A	2006-02-23
US5075503A	1991-12-24
JP2014506953A	2014-03-20
KR20200072358A	2020-06-22
KR102120821B1	2020-06-09
JP2006070125A	2006-03-16

SOGA, Michiharu et al. (JP)

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