Title:
CURING AGENT COMPOSITION FOR THERMOSETTING RESIN, EPOXY RESIN COMPOSITION, AND FIBER-REINFORCED COMPOSITE MATERIAL
Document Type and Number:
WIPO Patent Application WO/2023/145341
Kind Code:
A1
Abstract:
Provided is a curing agent composition for a thermosetting resin obtained by comprising a curing agent A, a curing agent B, and a curing agent C, the curing agent composition being characterized in that: the curing agent A is an aromatic polyamine having substituents, respectively, at two ortho positions to an amino group, the substituents being selected from an alkyl group, an aromatic group, and a halogen group; the curing agent B is an aromatic polyamine that is liquid at 25°C; and the curing agent C is a monoamine having an aromatic substituent. This curing agent composition for a thermosetting resin makes it possible to manufacture an epoxy resin composition that has low viscosity and can be used for a long time.
Inventors:
OZAWA SUGURU (JP)
ODA AKIMICHI (JP)
OSAKI KOHEI (JP)
ODA AKIMICHI (JP)
OSAKI KOHEI (JP)
Application Number:
PCT/JP2022/047536
Publication Date:
August 03, 2023
Filing Date:
December 23, 2022
Export Citation:
Assignee:
TEIJIN LTD (JP)
International Classes:
C08G59/50; C08G59/32; C08J5/04; C08J5/24
Domestic Patent References:
| WO2016208618A1 | 2016-12-29 |
Foreign References:
| JP2009227907A | 2009-10-08 | |||
| JPS62292823A | 1987-12-19 | |||
| JP2019157096A | 2019-09-19 | |||
| JP2012041486A | 2012-03-01 |
Attorney, Agent or Firm:
TAMEYAMA Taro (JP)
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