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Title:
CURING AGENT FOR EPOXY RESIN, AND ADHESIVE
Document Type and Number:
WIPO Patent Application WO/2023/153196
Kind Code:
A1
Abstract:
Excellent adhesive strength can be maintained to improve product reliability, even after storage under high humidity, by a curing agent (B) for an epoxy resin, the curing agent (B) containing a reactive terminated polydiene (B1), a reactive polyamine (B2), and an amidine (B3).

Inventors:
KOBAYASHI TOSHIO (JP)
NAKATSUJI TSUYOSHI (JP)
OKUNO TATSUYA (JP)
Application Number:
PCT/JP2023/002086
Publication Date:
August 17, 2023
Filing Date:
January 24, 2023
Export Citation:
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Assignee:
SUNSTAR ENGINEERING INC (JP)
International Classes:
C08G59/40; C08G59/50; C08G59/68; C09J11/06; C09J11/08; C09J163/00
Domestic Patent References:
WO2008004376A12008-01-10
WO2012063895A12012-05-18
WO2017179653A12017-10-19
WO2019021879A12019-01-31
Foreign References:
US20170029673A12017-02-02
KR20110080424A2011-07-13
CN101962436A2011-02-02
JPS60186579A1985-09-24
JP2002527551A2002-08-27
JP2020045450A2020-03-26
JP2020536988A2020-12-17
US20210122915A12021-04-29
JP2007051195A2007-03-01
Attorney, Agent or Firm:
YAMAO, Norihito et al. (JP)
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