CURING AGENT FOR WATER-BASED EPOXY RESIN, WATER-BASED EPOXY RESIN COMPOSITION, AND CURED PRODUCT THEREOF

Title:

CURING AGENT FOR WATER-BASED EPOXY RESIN, WATER-BASED EPOXY RESIN COMPOSITION, AND CURED PRODUCT THEREOF

Document Type and Number:

WIPO Patent Application WO/2019/225186

Kind Code:

A1

Abstract:

Provided is a curing agent for a water-based epoxy resin, the curing agent comprising a component (A) and a component (B) as follows: (A) at least one selected from the group consisting of (a1) polyamidoamine curing agents, (a2) reaction products of a polyamine compound with a polyepoxy compound, and (a3) Mannich reaction products of a polyamine compound, phenol compound, and aldehyde compound; (B) at least one selected from the group consisting of (b1) reaction products of styrene with an amine compound represented by general formula (1) below and (b2) reaction products of epichlorohydrin with an amine compound represented by general formula (1) below: H2N-CH2-A-CH2-NH2 (1) (In formula (1), A is a 1,2-phenylene group, 1,3-phenylene group, or 1,4-phenylene group.).

Inventors:

HANAOKA TAKUMA (JP)

Application Number:

PCT/JP2019/015566

Publication Date:

November 28, 2019

Filing Date:

April 10, 2019

Export Citation:

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Assignee:

MITSUBISHI GAS CHEMICAL CO (JP)

International Classes:

C08G59/20; C08G59/50; C09D5/02; C09D5/08; C09D163/00

Domestic Patent References:

WO2017175740A1	2017-10-12
WO2016088528A1	2016-06-09
WO2015027420A1	2015-03-05

Foreign References:

JP2001502378A	2001-02-20
JPH05178967A	1993-07-20
JP2018016672A	2018-02-01
JP2002080564A	2002-03-19
JP2006070125A	2006-03-16
JP2001502378A	2001-02-20

Other References: