CURING RESIN COMPOSITION, CURED PRODUCT THEREOF, PHENOLIC RESIN, EPOXY RESIN, AND SEMICONDUCTOR SEALING MATERIAL

WIPO Patent Application WO/2012/014715

A1

Provided is a heat-curing resin composition that has excellent fluidity, possesses moisture resistance reliability suitable for modern electronics-related materials, and is highly resistant to combustion and is halogen-free, and is therefore environmentally friendly. Also provided are a cured product thereof, a semiconductor sealing material in which the composition is used, and a phenolic resin and epoxy resin having these properties. The heat-curing resin composition contains epoxy resin (A) and phenolic resin (B) as essential components, wherein the phenolic resin (B) has a phenol resin structure with a basic skeleton in the form of a structure having a plurality of phenolic hydroxyl-containing aromatic skeletons (ph) linked via alkylidene groups or methylene groups containing an aromatic hydrocarbon structure, and also has naphthylmethyl groups or anthranylmethyl groups in the aromatic nuclei of the phenol resin structure.

OGURA ICHIROU (JP)
HIROTA YOUSUKE (JP)
TAKAHASHI YOSHIYUKI (JP)
NAGAE NORIO (JP)
NAKAMURA NOBUYA (JP)

PCT/JP2011/066342

February 02, 2012

July 19, 2011

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DAINIPPON INK & CHEMICALS (JP)
OGURA ICHIROU (JP)
HIROTA YOUSUKE (JP)
TAKAHASHI YOSHIYUKI (JP)
NAGAE NORIO (JP)
NAKAMURA NOBUYA (JP)

C08G59/62; C08G8/04; C08G59/20; C08K3/00; C08L63/00; H01L23/29; H01L23/31

WO2008041749A1

2008-04-10

JP2006117761A	2006-05-11
JP2006307162A	2006-11-09
JP2004059792A	2004-02-26
JP2004123859A	2004-04-22
JPH08120039A	1996-05-14
JP2004059792A	2004-02-26
JP2004123859A	2004-04-22

See also references of EP 2599812A4

KONO MICHIHIRO (JP)
Michihiro Kono (JP)

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