CUTTER WHEEL, SCRIBING METHOD AND CUTTING METHOD FOR FRAGILE MATERIAL SUBSTRATE USING THE CUTTER WHEEL, AND METHOD OF MANUFACTURING CUTTER WHEEL

Title:

CUTTER WHEEL, SCRIBING METHOD AND CUTTING METHOD FOR FRAGILE MATERIAL SUBSTRATE USING THE CUTTER WHEEL, AND METHOD OF MANUFACTURING CUTTER WHEEL

Document Type and Number:

WIPO Patent Application WO/2005/072926

Kind Code:

A1

Abstract:

[PROBLEMS] To provide a cutter wheel capable of stably forming a highly accurate scribing line even when the plate thickness of a fragile material substrate is small when the fragile material substrate is cut off and a scribing method for a fragile material substrate using the cutter wheel. [MEANS FOR SOLVING PROBLEMS] This cutter wheel for scribing a fragile material substrate is formed such that a V-shaped ridge line part is formed as an edge along the circular part of a disk-like wheel, and a plurality of projections of a specified shape are formed on the ridge line part at approximately equal intervals. The outer diameter of the wheel is 1.0 to 2.5 mm, the projections are formed all around the ridge line part at a pitch of 8 to 35 μm, the height of the projections is 0.5 to 6.0 μm, and a blade tip angle is 85 to 140°.

Inventors:

MAEKAWA KAZUYA (JP)
SAKAGUCHI RYOTA (JP)
MIURA YOSHITAKA (JP)

Application Number:

PCT/JP2005/001428

Publication Date:

August 11, 2005

Filing Date:

February 01, 2005

Export Citation:

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Assignee:

MITSUBOSHI DIAMOND IND CO LTD (JP)
MAEKAWA KAZUYA (JP)
SAKAGUCHI RYOTA (JP)
MIURA YOSHITAKA (JP)

International Classes:

B28D1/22; C03B33/027; C03B33/07; C03B33/10; (IPC1-7): B28D5/00; B24B3/46; B28D1/24; C03B33/10

Foreign References:

JPH09188534A	1997-07-22
JP3085312U	2002-04-26
JP3055262U	1999-01-12
JPH09239647A	1997-09-16

Other References: