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Patent Searching and Data


Title:
CUTTING APPARATUS AND CUTTING METHOD FOR LIQUID CRYSTAL PANEL
Document Type and Number:
WIPO Patent Application WO/2013/078632
Kind Code:
A1
Abstract:
Apparatus and method for cutting a liquid crystal panel (30). The liquid crystal panel (30) comprises a first substrate (31) and a second substrate (32) affixed to each other. The apparatus for cutting the liquid crystal panel (30) comprises a first cutter part (10) used for cutting the first substrate (31) and a second cutter part (20) used for cutting the second substrate (32). The second cutter part (20) comprises a first support part (26). The first support part (26) is used for supporting the first substrate (31) when the first cutter part (10) is cutting the first substrate (31) while the second cutter part (20) has yet to cut the second substrate (32). This ensures the cutting quality, increases the cutting efficiency, and conserves cutting costs.

Inventors:
LI DONG (CN)
SHE FENG (CN)
HUANG CHENG-MING (CN)
Application Number:
PCT/CN2011/083201
Publication Date:
June 06, 2013
Filing Date:
November 30, 2011
Export Citation:
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Assignee:
SHENZHEN CHINA STAR OPTOELECTRONICS TECHNOLOGYCO LTD (CN)
LI DONG (CN)
SHE FENG (CN)
HUANG CHENG-MING (CN)
International Classes:
G02F1/1333; B26D3/08; C03B33/03
Foreign References:
CN1265947C2006-07-26
KR20060072556A2006-06-28
CN201473449U2010-05-19
JPH05105465A1993-04-27
US20100011927A12010-01-21
CN101565270A2009-10-28
JP2007045642A2007-02-22
Attorney, Agent or Firm:
ESSEN PATENT & TRADEMARK AGENCY (CN)
深圳翼盛智成知识产权事务所(普通合伙) (CN)
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Claims: