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Title:
CUTTING DEVICE AND METHOD FOR IDENTIFYING POSITIONAL RELATIONSHIP
Document Type and Number:
WIPO Patent Application WO/2023/181264
Kind Code:
A1
Abstract:
A motion control unit 101 moves a cutting tool 20 relative to a workpiece 30 in a direction of contact between the cutting tool 20 and the workpiece 30 while imparting a rotational motion or a motion along a predetermined path to one of the cutting tool 20 and the workpiece 30. An acquisition unit 104 acquires a signal indicating the presence or absence of the contact between the cutting tool 20 and the workpiece 30. A processing unit 105 identifies a section where the cutting tool 20 and the workpiece 30 are in contact from the signal acquired by the acquisition unit 104 and identifies, from the identified section, a relative positional relationship of the cutting tool 20 and the workpiece 30.

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Inventors:
SHAMOTO EIJI (JP)
Application Number:
PCT/JP2022/014005
Publication Date:
September 28, 2023
Filing Date:
March 24, 2022
Export Citation:
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Assignee:
NATIONAL UNIV CORPORATION TOKAI NATIONAL HIGHER EDUCATION AND RESEARCH SYSTEM (JP)
International Classes:
B23Q17/22; B23Q15/00
Domestic Patent References:
WO2019044911A12019-03-07
Foreign References:
JP2021100784A2021-07-08
JP2007290103A2007-11-08
JP2007320022A2007-12-13
JPS4840861B11973-12-03
JPS5213187A1977-02-01
Attorney, Agent or Firm:
MORISHITA Sakaki (JP)
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