CUTTING DEVICE, AND METHOD FOR MANUFACTURING CUT PRODUCT

WIPO Patent Application WO/2023/112464

A1

This cutting device comprises a table, a cutting mechanism, a holding mechanism, and a water isolation/discharge mechanism. The table or the holding mechanism is connected to a dry vacuum pump through a suction path. The water isolation/discharge mechanism is positioned on the suction path and discharges water through a water discharge path. The water isolation/discharge mechanism includes a first tank, a second tank, and a valve mechanism. The first tank includes a partition plate for partitioning the tank into a region where a connection opening leading to the vacuum pump is positioned and a region where a connection opening leading to the table or the holding mechanism is positioned. A space is formed in the first tank above the partition plate. The valve mechanism changes between a first state, in which water flowing from the first tank into the second tank is reserved in the second tank, and a second state, in which water is reserved in the first tank and the water reserved in the second tank is discharged.

JPH11277354	HOLDING DEVICE FOR TABULAR WORK
JPS63272440	ADSORPTION TABLE
WO/2018/161012	EXPANDABLE LOCATING PIN

IGUCHI HARUKI (JP)
HOSOMI TAKAYA (JP)
SAKAMOTO RIN (JP)

PCT/JP2022/038572

June 22, 2023

October 17, 2022

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TOWA CORP (JP)

B23Q3/08; B24B27/06; B24B41/06; B24B55/06; B28D1/24; B28D7/02; B28D7/04; H01L21/301

CN209868312U	2019-12-31
JP2019051645A	2019-04-04
US6241226B1	2001-06-05
JP2009028881A	2009-02-12
JP2011104726A	2011-06-02
JP2021072396A	2021-05-06

FUJIWARA Satoshi et al. (JP)

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